Lorenzo Codecasa and Dario D'Amore of DEIB, together with his colleague VIncenzo d'Alessandro of the Federico II University of Naples, won the "THERMINIC 2019 best paper award", with "Algorithm for Establishing the Dependence of Structure Functions on Spatial Distributions of Thermal Properties". THERMINIC 2019, in Europe, and ITHERM 2019, in the United States, both sponsored by IEEE, are the most important international conferences of the year in which the thermal issues of circuits and electronic systems are investigated. This year THERMINIC was hosted by the Politecnico di Milano, at the Campus of Lecco. https://therminic2019.eu/

THERMINIC 2019: https://therminic2019.eu/