Paolo Manfredi received the M.Sc. degree in electronic engineering from the Politecnico di Torino, Turin, Italy, in 2009, and the Ph.D. degree in information and communication technology from the Scuola Interpolitecnica di Dottorato, Politecnico di Torino, Torino, Italy, in 2013. He is currently a Postdoctoral Research Fellow of the Research Foundation–Flanders (FWO) with the Electromagnetics Group, Department of Information Technology, IDLab, Ghent University - imec, Gent, Belgium. He has been a Visiting Scientist with the Center for Advanced Life Cycle Engineering, University of Maryland at College Park, MD, USA. From March 2013 to September 2014, he was a Postdoctoral Researcher with the EMC Group, Department of Electronics and Telecommunications, Politecnico di Torino. He has authored or coauthored more than 50 publications in international journals and conferences proceedings. He served as the Program Co-Chair of the 20th and 21st IEEE Workshop on Signal and Power Integrity (SPI 2016 and SPI 2017). His research interests comprise several aspects of circuit and interconnect modeling and simulation, including statistical and worst case analysis, signal integrity, and electromagnetic compatibility. Dr. Manfredi received the Best Paper Award at the 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, the Best Oral Paper Award and the Best Student Paper Award at the 22nd and 19th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, respectively, a Young Scientist Award at the XXX International Union of Radio Science General Assembly and Scientific Symposium, and an Honorable Mention from the 2011 IEEE Microwave Theory and Techniques Society International Microwave Symposium.